| Parameters | |
|---|---|
| Factory Lead Time | 25 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 1 week ago) |
| Package / Case | 16-VFQFN Exposed Pad, CSP |
| Surface Mount | YES |
| Number of Pins | 16 |
| Packaging | Strip |
| Size / Dimension | 0.118Lx0.118W 3.00mmx3.00mm |
| JESD-609 Code | e3 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 16 |
| Terminal Finish | Tin (Sn) |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 5.5V |
| Terminal Pitch | 0.5mm |
| Frequency | 100MHz~15GHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | HMC862 |
| Pin Count | 16 |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Temperature Grade | INDUSTRIAL |
| Telecom IC Type | TELECOM CIRCUIT |
| Height Seated (Max) | 1mm |
| Length | 3mm |
| Width | 3mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |