| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 2 weeks ago) |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | 24-VFQFN Exposed Pad |
| Number of Pins | 24 |
| Packaging | Tape & Reel (TR) |
| JESD-609 Code | e3 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 24 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 560mW |
| Technology | CMOS |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | HMC624 |
| Pin Count | 24 |
| Operating Supply Voltage | 5V |
| Temperature Grade | INDUSTRIAL |
| Number of Channels | 1 |
| Impedance | 50Ohm |
| Number of Bits | 6 |
| Max Input Voltage | 5.6V |
| Bandwidth | 5.9 GHz |
| Max Frequency | 6GHz |
| Frequency Range | 0Hz~6GHz |
| Telecom IC Type | TELECOM CIRCUIT |
| Insertion Loss (dB) | 3.8 dB |
| Attenuation Value | 31.5dB |
| Max Junction Temperature (Tj) | 150°C |
| Height | 900μm |
| Length | 4mm |
| RoHS Status | ROHS3 Compliant |