HDG200-DN-3
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 44-TQFN Exposed Pad Module |
| Supplier Device Package | 44-QFN SIP (8x8) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | TxRx + MCU |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Voltage - Supply | 2.75V~3.6V |
| Frequency | 2.4GHz |
| Interface | SDIO, SPI |
| Memory Size | 1kB EEPROM 160kB SRAM |
| Protocol | 802.11b/g/n |
| Power - Output | 17dBm |
| RF Family/Standard | WiFi |
| Data Rate (Max) | 72.2Mbps |
| Serial Interfaces | SDIO, SPI |
| Current - Receiving | 49mA |
| Current - Transmitting | 197mA |
| RoHS Status | RoHS Compliant |
HDG200-DN-3 Overview
The 44-TQFN Exposed Pad Module package conserves RF transceiver IC's board space. Surface Mount is used for RF transceiver's mounting.With transceiver RF's high efficiency and reliable performance, it emerges as a TxRx + MCU.High reliability is achieved using advanced transceiver RF' packaging Tray.A frequency of 2.4GHz is used to operate RF transceiver.
HDG200-DN-3 Features
44-TQFN Exposed Pad Module package
Surface Mount for mounting
TxRx + MCU
Tray is used
HDG200-DN-3 Applications
There are a lot of H&D Wireless AB HDG200-DN-3 RF Transceiver ICs applications.
- LED Lighting
- Internet of Things (IoT)
- Low Noise Amplifier (LNA)
- Home and Security
- M2M Communication
- Transmit
- HVAC
- Remote Device Management
- Utility and Smart Energy