| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA Exposed Pad |
| Surface Mount | YES |
| Number of Pins | 484 |
| Packaging | Bulk |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | 3A001.A.3 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.31.00.01 |
| Subcategory | Microprocessors |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.1V |
| Terminal Pitch | 1mm |
| Base Part Number | GC6016 |
| Function | Digital Signal Processor |
| Supply Voltage-Max (Vsup) | 1.15V |
| Power Supplies | 1.21.83.3V |
| Supply Voltage-Min (Vsup) | 1.05V |
| Clock Frequency | 310MHz |
| Address Bus Width | 8 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| External Data Bus Width | 16 |
| Format | FLOATING POINT |
| RF Type | LTE, TDS-CDMA, W-CDMA |
| Secondary Attributes | Up/Down Converter |
| Barrel Shifter | NO |
| Internal Bus Architecture | MULTIPLE |
| Height Seated (Max) | 2.48mm |
| Length | 23mm |
| Width | 23mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |