FX604D4
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 16-SOIC (0.295, 7.50mm Width) |
| Surface Mount | YES |
| Published | 1996 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 16 |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | HALF DUPLEX |
| HTS Code | 8542.39.00.01 |
| Subcategory | Modems |
| Technology | CMOS |
| Voltage - Supply | 3V~5.5V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 16 |
| JESD-30 Code | R-PDSO-G16 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Power Supplies | 3/5V |
| Temperature Grade | INDUSTRIAL |
| Supply Current-Max | 0.0025mA |
| Data Rate | 1.2 Mbps |
| Telecom IC Type | MODEM |
| Baud Rate | 1.2k |
| Data Format | FSK, V.23 |
| Height Seated (Max) | 2.67mm |
| Length | 10.26mm |
| Width | 7.49mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet