 
    | Parameters | |
|---|---|
| Factory Lead Time | 9 Weeks | 
| Mount | Surface Mount | 
| Mounting Type | Surface Mount | 
| Package / Case | 256-BGA, CSBGA | 
| Number of Pins | 256 | 
| Packaging | Tray | 
| Published | 2012 | 
| JESD-609 Code | e1 | 
| Pbfree Code | yes | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 
| Number of Terminations | 256 | 
| ECCN Code | EAR99 | 
| Type | TDM (Time Division Multiplexing) | 
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -40°C | 
| Applications | Data Transport | 
| HTS Code | 8542.39.00.01 | 
| Subcategory | Digital Transmission Interfaces | 
| Terminal Position | BOTTOM | 
| Terminal Form | BALL | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 1.8V | 
| Terminal Pitch | 1mm | 
| Time@Peak Reflow Temperature-Max (s) | 30 | 
| Base Part Number | DS34S104 | 
| Pin Count | 256 | 
| Operating Supply Voltage | 3.3V | 
| Temperature Grade | INDUSTRIAL | 
| Interface | SPI | 
| Max Supply Voltage | 3.465V | 
| Min Supply Voltage | 3.135V | 
| Operating Supply Current | 225mA | 
| Supply Current-Max | 0.28mA | 
| Data Rate | 100 Mbps | 
| Height | 1.26mm | 
| Length | 17mm | 
| Width | 17mm | 
| Radiation Hardening | No | 
| RoHS Status | ROHS3 Compliant |