Parameters |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Published |
2006 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Voltage - Supply |
3.135V~3.465V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
240 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Time@Peak Reflow Temperature-Max (s) |
20 |
Base Part Number |
DS3112 |
Pin Count |
256 |
JESD-30 Code |
S-PBGA-B256 |
Qualification Status |
Not Qualified |
Interface |
Parallel/Serial |
Current - Supply |
150mA |
Telecom IC Type |
FRAMER |
Height Seated (Max) |
2.34mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
DS3112D1 Overview
256-BGA package is used to save board space.To pack telecommunications equipment, the way of Tray is used.Surface Mount is used as telecommunications equipment mounting type.When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.At 0°C~70°C, reliable performance can be achieved.The configuration includes 256 terminations.3.3V is its supply voltage.DS3112 is the base part number, which can be used to find more related parts.It uses a FRAMER type telecom IC.Telecom equipment operates wit h a supply current of 150mA.When designing, it is configured with 1 functions.Pins on 256 telecom products are designed to fit its configuration.
DS3112D1 Features
Available in the 256-BGA package
FRAMER as telecom IC type
DS3112D1 Applications
There are a lot of Maxim Integrated DS3112D1 Telecom applications.
- Cable PC
- Fiber In The Loop (FITL)
- High speed data transmission line cards
- T1/E1/J1 Multiplexer and Channel Banks
- Digital Modems
- Digital loop carrier (DLC)
- E1 Multiplexer
- Public switching systems
- Intelligent PBX
- Cable Modem