 
    | Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks | 
| Mounting Type | Surface Mount | 
| Package / Case | 6-WDFN Exposed Pad | 
| Packaging | Tape & Reel (TR) | 
| Published | 2016 | 
| Series | DeepCover® | 
| JESD-609 Code | e3 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Type | Authentication Chip | 
| Terminal Finish | Matte Tin (Sn) | 
| Applications | Networking and Communications | 
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | 
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | 
| Base Part Number | DS28C36 | 
| RoHS Status | ROHS3 Compliant |