 
    | Parameters | |
|---|---|
| Mounting Type | Surface Mount | 
| Package / Case | 300-BBGA | 
| Surface Mount | YES | 
| Operating Temperature | -40°C~85°C | 
| Packaging | Tube | 
| Published | 2002 | 
| JESD-609 Code | e3 | 
| Pbfree Code | yes | 
| Part Status | Obsolete | 
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | 
| Number of Terminations | 300 | 
| Terminal Finish | Matte Tin (Sn) | 
| HTS Code | 8542.39.00.01 | 
| Subcategory | Other Telecom ICs | 
| Technology | CMOS | 
| Voltage - Supply | 2.97V~3.63V | 
| Terminal Position | BOTTOM | 
| Terminal Form | BALL | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 3.3V | 
| Terminal Pitch | 1.27mm | 
| Time@Peak Reflow Temperature-Max (s) | 30 | 
| Base Part Number | DS21FF42 | 
| Pin Count | 300 | 
| JESD-30 Code | S-PBGA-B300 | 
| Qualification Status | Not Qualified | 
| Power Supplies | 3.3V | 
| Interface | Parallel/Serial | 
| Current - Supply | 300mA | 
| Telecom IC Type | FRAMER | 
| Height Seated (Max) | 2.54mm | 
| Length | 27mm | 
| Width | 27mm | 
| RoHS Status | ROHS3 Compliant | 
| Lead Free | Lead Free |