DIP300T600P28

DIP300T600P28

DIP-28 (0.3" BODY) TO DIP-28 (0.


  • Manufacturer: Chip Quik Inc.
  • Origchip NO: 138-DIP300T600P28
  • Package: -
  • Datasheet: PDF
  • Stock: 313
  • Description: DIP-28 (0.3" BODY) TO DIP-28 (0. (Kg)

Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 1.400Lx0.700W 35.56mmx17.78mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 28
Pitch 0.100 2.54mm
Proto Board Type DIP to DIP
Board Thickness 0.063 1.60mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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