DIP300T600P08

DIP300T600P08

DIP-8 (0.3" BODY) TO DIP-8 (0.6"


  • Manufacturer: Chip Quik Inc.
  • Origchip NO: 138-DIP300T600P08
  • Package: -
  • Datasheet: PDF
  • Stock: 426
  • Description: DIP-8 (0.3" BODY) TO DIP-8 (0.6" (Kg)

Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 0.700Lx0.400W 17.78mmx10.16mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 8
Pitch 0.100 2.54mm
Proto Board Type DIP to DIP
Board Thickness 0.063 1.60mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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