| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mount | Chassis Mount |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Operating Temperature | -20°C~100°C |
| Packaging | Box |
| Series | VI Chip® DCM® (500W) |
| Size / Dimension | 3.75Lx1.40W x 0.37 H 95.1mmx35.5mmx9.3mm |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 9 |
| ECCN Code | EAR99 |
| Type | Enclosed |
| Applications | ITE (Commercial) |
| Max Power Dissipation | 500W |
| Technology | HYBRID |
| Terminal Position | UNSPECIFIED |
| Terminal Form | UNSPECIFIED |
| Number of Functions | 1 |
| JESD-30 Code | R-XXMA-X9 |
| Number of Outputs | 1 |
| Approval Agency | CE |
| Efficiency | 93.4% |
| Voltage - Input (Max) | 400V |
| Output Voltage | 48V |
| Voltage - Output 1 | 48V |
| Voltage - Input (Min) | 200V |
| Input Voltage-Nom | 300V |
| Trim/Adjustable Output | YES |
| Current - Output (Max) | 10.42A |
| Protections | THERMAL |
| Warm-up Time | 0.3 s |
| Height | 9.398mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |