Parameters | |
---|---|
Factory Lead Time | 10 Weeks |
Mounting Type | Surface Mount |
Package / Case | 24-SOIC (0.295, 7.50mm Width) |
Surface Mount | YES |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 24 |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | HALF DUPLEX; FULL DUPLEX |
HTS Code | 8542.39.00.01 |
Subcategory | Modems |
Technology | CMOS |
Voltage - Supply | 3V~5.5V |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 24 |
JESD-30 Code | R-PDSO-G24 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Power Supplies | 3.3/5V |
Temperature Grade | INDUSTRIAL |
Data Rate | 200 Mbps |
Telecom IC Type | MODEM |
Baud Rate | 200k |
Height Seated (Max) | 2.65mm |
Length | 15.4mm |
Width | 7.5mm |
RoHS Status | ROHS3 Compliant |