CDR33BX104AKUS
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | Ceramic |
| Terminal Shape | WRAPAROUND |
| Published | 2005 |
| Tolerance | 10% |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Temperature Coefficient | 15% ppm/°C |
| Terminal Finish | Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8532.24.00.20 |
| Capacitance | 100nF |
| Voltage - Rated DC | 50V |
| Packing Method | TR, 7 INCH |
| Depth | 2.5mm |
| Reference Standard | MIL-PRF-55681 |
| Dielectric | X7R |
| Temperature Characteristics Code | BX |
| Multilayer | Yes |
| Size Code | 1210 |
| Length | 3.2mm |
| Width | 2.5mm |
| Thickness | 1.5mm |
| RoHS Status | RoHS Compliant |
CDR33BX104AKUS Overview
There is no temperature coefficient for it.A case of Ceramic is used to package the product.Electrical part rated at DC 50V voltage.
CDR33BX104AKUS Features
A temperature coefficient of 15% ppm/°C
CDR33BX104AKUS Applications
There are a lot of KEMET CDR33BX104AKUS applications of capacitor networks.
- High density consumer electronics
- Professional electronics