CDR32BX153BKSP
| Parameters | |
|---|---|
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 111 Weeks |
| Mount | Surface Mount |
| Package / Case | 1206 |
| Terminal Shape | WRAPAROUND |
| Dielectric Material | Ceramic |
| Published | 2005 |
| Series | C(SIZE)N |
| Tolerance | 10% |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Temperature Coefficient | 15% ppm/°C |
| Terminal Finish | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8532.24.00.20 |
| Capacitance | 15nF |
| Voltage - Rated DC | 100V |
| Packing Method | TR, 7 INCH |
| Depth | 1.6mm |
| Reference Standard | MIL-PRF-55681 |
| Dielectric | X7R |
| Temperature Characteristics Code | BX |
| Multilayer | Yes |
| Length | 3.2mm |
| Width | 1.6mm |
| Thickness | 1.3mm |
CDR32BX153BKSP Overview
The temperature coefficient of this substance is 15% ppm/°C.A case of 1206 is used to package the product.A voltage of 100V is required for the operation of this electrical part.
CDR32BX153BKSP Features
A temperature coefficient of 15% ppm/°C
CDR32BX153BKSP Applications
There are a lot of KEMET CDR32BX153BKSP applications of capacitor networks.
- Professional electronics
- High density consumer electronics