| Parameters | |
|---|---|
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 3.3V |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 256 |
| Operating Supply Voltage | 5V |
| Supply Voltage-Max (Vsup) | 3.46V |
| Temperature Grade | INDUSTRIAL |
| Interface | PCI, Serial |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Frequency (Max) | 33MHz |
| Data Bus Width | 32b |
| Bus Compatibility | MC68360; MPC860 |
| Height Seated (Max) | 3.5mm |
| Length | 27mm |
| Width | 27mm |
| Thickness | 2mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
| Factory Lead Time | 7 Weeks |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | BGA |
| Number of Pins | 256 |
| Published | 1999 |