Parameters | |
---|---|
Factory Lead Time | 8 Weeks |
Contact Plating | Tin |
Mount | PCB, Surface Mount |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Terminal Shape | WRAPAROUND |
Number of Pins | 2 |
Dielectric Material | Ceramic |
Operating Temperature | -55°C~125°C |
Packaging | Tape & Reel (TR) |
Published | 2005 |
Series | SMD Comm C0G |
Size / Dimension | 0.079Lx0.049W 2.00mmx1.25mm |
Tolerance | ±10% |
JESD-609 Code | e3 |
Feature | Low ESL |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Temperature Coefficient | C0G NP0 |
Applications | General Purpose |
Capacitance | 100pF |
Voltage - Rated DC | 50V |
Packing Method | TR, PAPER, 7 INCH |
Depth | 1.25mm |
Case Code (Metric) | 2012 |
Case Code (Imperial) | 0805 |
Lead Pitch | 750μm |
Dielectric | C0G |
Temperature Characteristics Code | C0G |
Multilayer | Yes |
Voltage | 50V |
Dissipation Factor | 0.1 % |
Height | 880μm |
Thickness (Max) | 0.035 0.88mm |
Thickness | 889μm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |