BGB741L7ESDE6327XTSA1
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 6-XFDFN Exposed Pad |
| Number of Pins | 6 |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| JESD-609 Code | e4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Terminal Finish | Gold (Au) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 120mW |
| Voltage - Supply | 1.8V~4V |
| Construction | COMPONENT |
| Frequency | 50MHz~3.5GHz |
| Test Frequency | 1.5GHz |
| Current - Supply | 30mA |
| Halogen Free | Halogen Free |
| Gain | 19.5dB |
| RF/Microwave Device Type | WIDE BAND LOW POWER |
| RF Type | Cellular, RKE, WiFi |
| Input Power-Max (CW) | 20dBm |
| Characteristic Impedance | 50Ohm |
| Max Junction Temperature (Tj) | 150°C |
| Noise Figure | 1dB |
| P1dB | -6.5dBm |
| Height | 500μm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet