BGA5H1BN6E6327XTSA1
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 6-XFDFN |
| Surface Mount | YES |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Voltage - Supply | 1.5V~3.6V |
| Terminal Position | BOTTOM |
| Terminal Form | BUTT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.4mm |
| Frequency | 2.3GHz~2.69GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XBCC-B6 |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Temperature Grade | INDUSTRIAL |
| Test Frequency | 2.5GHz |
| Current - Supply | 8.5mA |
| Gain | 18.1dB |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | LTE |
| Noise Figure | 0.7dB |
| P1dB | -17dBm |
| Height Seated (Max) | 0.4mm |
| Length | 1.1mm |
| Width | 0.7mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet