BDN18-6CB/A01

BDN18-6CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ


Details

Tags

Parameters
Factory Lead Time 14 Weeks
Material Aluminum
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2007
Series BDN
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Construction EXTRUDED
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.605 15.37mm
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 400 LFM
Thermal Resistance @ Natural 8.10°C/W
Profile PIN FIN ARRAY
Fin Orientation OMNIDIRECT
Device Used On IC
Length 1.810 45.97mm
Width 1.810 45.97mm
RoHS Status RoHS Compliant
See Relate Datesheet

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