Parameters | |
---|---|
Factory Lead Time | 14 Weeks |
Material | Aluminum |
Shape | Square, Pin Fins |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Material Finish | Black Anodized |
Published | 2007 |
Series | BDN |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Top Mount |
Construction | EXTRUDED |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height Off Base (Height of Fin) | 0.355 9.02mm |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 400 LFM |
Thermal Resistance @ Natural | 16.10°C/W |
Profile | PIN FIN ARRAY |
Fin Orientation | OMNIDIRECT |
Device Used On | IC |
Length | 1.310 33.27mm |
Width | 1.310 33.27mm |
RoHS Status | RoHS Compliant |