| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 24-DIP Module |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2016 |
| Series | VI Chip® BCM® |
| Size / Dimension | 2.40Lx0.99W x 0.29 H 61.0mmx25.1mmx7.3mm |
| Feature | OCP, OTP, OVP, SCP, UVLO |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN Code | EAR99 |
| Type | Bus Converter Module |
| Applications | ITE (Commercial) |
| Power (Watts) | 1.95kW |
| Max Power Dissipation | 1.95kW |
| Number of Outputs | 1 |
| Efficiency | 97.4% |
| Voltage - Isolation | 2.25kV |
| Voltage - Input (Max) | 60V |
| Max Output Current | 130A |
| Voltage - Output 1 | 15V |
| Voltage - Input (Min) | 36V |
| Height | 7.366mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |