 
    | Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks | 
| Mount | Through Hole | 
| Mounting Type | Through Hole | 
| Package / Case | Module | 
| Operating Temperature | -40°C~125°C | 
| Packaging | Tray | 
| Published | 2015 | 
| Series | VI Chip® BCM® (300W) | 
| Size / Dimension | 1.28Lx0.87W x 0.26 H 32.5mmx22.0mmx6.7mm | 
| Feature | OCP, OTP, SCP, UVLO | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | 
| Number of Terminations | 60 | 
| ECCN Code | EAR99 | 
| Type | Bus Converter Module | 
| Applications | ITE (Commercial) | 
| Power (Watts) | 300W | 
| Max Power Dissipation | 288W | 
| Technology | HYBRID | 
| Terminal Position | QUAD | 
| Number of Functions | 1 | 
| JESD-30 Code | R-XQMA-T60 | 
| Number of Outputs | 1 | 
| Efficiency | 96% | 
| Voltage - Isolation | 2.25kV | 
| Voltage - Input (Max) | 55V | 
| Output Voltage | 48V | 
| Max Output Current | 6A | 
| Voltage - Output 1 | 48V | 
| Voltage - Input (Min) | 38V | 
| Input Voltage-Nom | 48V | 
| Trim/Adjustable Output | NO | 
| Current - Output (Max) | 6.25A | 
| Total Power Output-Max | 300W | 
| Height | 6.858mm | 
| Length | 32.5mm | 
| Width | 22mm | 
| RoHS Status | ROHS3 Compliant |