Parameters | |
---|---|
Factory Lead Time | 16 Weeks |
Mounting Type | Through Hole |
Package / Case | 9-DIP Module |
Surface Mount | NO |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2017 |
Series | VI Chip® BCM® |
Size / Dimension | 2.49Lx0.90W x 0.29 H 63.3mmx22.8mmx7.3mm |
Feature | OCP, OTP, OVP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 9 |
ECCN Code | EAR99 |
Type | Bus Converter Module |
Applications | ITE (Commercial) |
Power (Watts) | 1.75kW |
Technology | HYBRID |
Terminal Position | DUAL |
Number of Functions | 1 |
JESD-30 Code | R-XDMA-T9 |
Number of Outputs | 1 |
Approval Agency | CE, CTUVUS,CURUS,EN,UL |
Efficiency | 98% |
Voltage - Isolation | 4.242kV |
Voltage - Input (Max) | 410V |
Output Voltage | 50V |
Voltage - Output 1 | 50V |
Voltage - Input (Min) | 260V |
Input Voltage-Nom | 400V |
Trim/Adjustable Output | YES |
Current - Output (Max) | 35A |
Protections | OUTPUT OVER CURRENT; OUTPUT OVER VOLTAGE; THERMAL |
Control Mode | VOLTAGE-MODE |
Height | 7.76mm |
Height Seated (Max) | 7.76mm |
Length | 63.34mm |
Width | 22.8mm |
RoHS Status | ROHS3 Compliant |