| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Through Hole |
| Package / Case | 9-DIP Module |
| Surface Mount | NO |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Series | VI Chip® BCM® |
| Size / Dimension | 2.49Lx0.90W x 0.29 H 63.3mmx22.8mmx7.3mm |
| Feature | OCP, OTP, OVP, SCP, UVLO |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 9 |
| ECCN Code | EAR99 |
| Type | Bus Converter Module |
| Applications | ITE (Commercial) |
| Power (Watts) | 1.75kW |
| Technology | HYBRID |
| Terminal Position | DUAL |
| Number of Functions | 1 |
| JESD-30 Code | R-XDMA-T9 |
| Number of Outputs | 1 |
| Approval Agency | CE, CTUVUS,CURUS,EN,UL |
| Efficiency | 98% |
| Voltage - Isolation | 4.242kV |
| Voltage - Input (Max) | 410V |
| Output Voltage | 50V |
| Voltage - Output 1 | 50V |
| Voltage - Input (Min) | 260V |
| Input Voltage-Nom | 400V |
| Trim/Adjustable Output | YES |
| Current - Output (Max) | 35A |
| Protections | OUTPUT OVER CURRENT; OUTPUT OVER VOLTAGE; THERMAL |
| Control Mode | VOLTAGE-MODE |
| Height | 7.76mm |
| Height Seated (Max) | 7.76mm |
| Length | 63.34mm |
| Width | 22.8mm |
| RoHS Status | ROHS3 Compliant |