| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 9-DIP Module |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Series | VI Chip® BCM® (800W) |
| Size / Dimension | 2.49Lx0.90W x 0.29 H 63.3mmx22.8mmx7.3mm |
| Feature | OCP, OTP, OVP, SCP, UVLO |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN Code | EAR99 |
| Type | Bus Converter Module |
| Applications | ITE (Commercial) |
| Power (Watts) | 800W |
| Max Power Dissipation | 760W |
| Number of Outputs | 1 |
| Efficiency | 97.5% |
| Voltage - Isolation | 4.242kV |
| Voltage - Input (Max) | 410V |
| Max Output Current | 16A |
| Voltage - Output 1 | 47.5V |
| Voltage - Input (Min) | 260V |
| Height | 7.366mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |