B88069X8690B502
| Parameters | |
|---|---|
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
| Contact Plating | Tin |
| Mount | Through Hole |
| Package / Case | Radial |
| Packaging | Bulk |
| Number of Terminations | 3 |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Capacitance | 1.5pF |
| Terminal Position | UNSPECIFIED |
| Terminal Form | WIRE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Depth | 8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 3 |
| JESD-30 Code | O-XXSS-W3 |
| Qualification Status | Not Qualified |
| Lead Pitch | 4.4mm |
| Temperature Grade | INDUSTRIAL |
| Insulation Resistance | 10GOhm |
| Max Voltage Rating (DC) | 350V |
| Peak Pulse Current | 15kA |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Diameter | 7.2mm |
| Height | 10.5mm |
| Length | 10mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
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