| Parameters | |
|---|---|
| Contact Plating | Tin |
| Mount | Surface Mount |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | UNSPECIFIED |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 2 |
| JESD-30 Code | O-XXSS-X2 |
| Temperature Grade | INDUSTRIAL |
| Insulation Resistance | 10GOhm |
| Max Voltage Rating (DC) | 600V |
| Peak Pulse Current | 25kA |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Diameter | 8mm |
| Length | 20mm |
| RoHS Status | RoHS Compliant |