ATS-52310P-C1-R0

ATS-52310P-C1-R0

Heat Sink Passive BGA Spread Adhesive 3.28C/W Blue Anodized


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Origchip NO: 17-ATS-52310P-C1-R0
  • Package: -
  • Datasheet: -
  • Stock: 421
  • Description: Heat Sink Passive BGA Spread Adhesive 3.28C/W Blue Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 6 Weeks
Mount Adhesive
Material Aluminum
Shape Square, Angled Fins
Package Cooled BGA
Material Finish Blue Anodized
Published 2008
Series maxiFLOW
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Blue
Depth 31mm
Construction EXTRUDED
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.689 17.50mm
Thermal Resistance @ Forced Air Flow 3.30°C/W @ 200 LFM
Device Used On IC
Height 17.5mm
Length 1.220 30.99mm
Width 1.220 30.99mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good