 
    | Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks | 
| Mount | Surface Mount | 
| Mounting Type | Surface Mount | 
| Package / Case | 8-UFDFN Exposed Pad | 
| Manufacturer Package Identifier | C04-21355-Q4B | 
| Packaging | Tape & Reel (TR) | 
| Published | 2009 | 
| Series | CryptoAuthentication™ | 
| JESD-609 Code | e4 | 
| Pbfree Code | yes | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 8 | 
| Type | Authentication Chip | 
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -40°C | 
| Applications | Networking and Communications | 
| Technology | CMOS | 
| Terminal Position | DUAL | 
| Terminal Form | NO LEAD | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Terminal Pitch | 0.5mm | 
| Time@Peak Reflow Temperature-Max (s) | 40 | 
| Base Part Number | ATECC508A | 
| JESD-30 Code | R-PDSO-N8 | 
| Temperature Grade | INDUSTRIAL | 
| Interface | I2C, Serial | 
| Max Supply Voltage | 5.5V | 
| Min Supply Voltage | 2V | 
| Access Time | 550 ns | 
| Max Frequency | 1MHz | 
| Ambient Temperature Range High | 85°C | 
| Height | 600μm | 
| Length | 3mm | 
| Width | 2mm | 
| RoHS Status | ROHS3 Compliant | 
| Lead Free | Lead Free |