| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA, CABGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Published | 2016 |
| Series | FPSLIC® |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1mm |
| Frequency | 16MHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 3.3V |
| Interface | I2C, UART |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 2304 |
| EEPROM Size | 1M x 8 |
| Core Type | 8-Bit AVR |
| Number of Equivalent Gates | 40000 |
| Data SRAM Bytes | 4K ~ 16K |
| FPGA Gates | 40K |
| Program SRAM Bytes | 20K-32K |
| FPGA Registers | 2862 |
| FPGA SRAM | 18kb |
| Height Seated (Max) | 1.5mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |