ASM06DRAN

ASM06DRAN

ASM06DRAN datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at ORIGCHIP


  • Manufacturer: Sullins Connector Solutions
  • Origchip NO: 765-ASM06DRAN
  • Package: -
  • Datasheet: PDF
  • Stock: 869
  • Description: ASM06DRAN datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at ORIGCHIP(Kg)

Details

Tags

Parameters
Withdrawl Force-Min .139 N
Contact Finish Thickness 10.0μin 0.25μm
Plating Thickness 10μin
Card Thickness 0.062 1.57mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole, Right Angle
Material - Insulation Polyphenylene Sulfide (PPS)
Operating Temperature -65°C~150°C
Packaging Tray
Published 2015
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Full Bellows
Number of Positions 12
Color Green
Number of Rows 2
Gender Female
Subcategory Headers and Edge Type Connectors
Contact Type Full Bellows
Pitch 0.156 3.96mm
Total Number of Contacts 12
Number of Conductors ONE
Reference Standard UL, CSA
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 1.875 inch
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Depth 0.431 inch
Rated Current (Signal) 3A
Contact Resistance 30mOhm
Card Type Non Specified - Dual Edge
Read Out Dual
Insulation Resistance 5000000000Ohm
Number of Positions/Bay/Row 6
Body/Shell Style RECEPTACLE
Dielectric Withstanding Voltage 1800VDC V

ASM06DRAN Overview


The material was packaged according to the specifications provided by Tray.It is recommended to mount the device using type Through Hole, Right Angle.This device is connected through the connector socket Full Bellows.

ASM06DRAN Features



ASM06DRAN Applications


There are a lot of Sullins Connector Solutions ASM06DRAN Edgeboard Connectors applications.

  • Battery Operated Systems
  • Spectrum Analysis
  • Broadband data applications
  • RADAR processing, digital oscilloscopes
  • Scientific instruments.
  • Communication test equipment
  • Automotive
  • Medical Imaging
  • TD-SCDMA, WiMAX
  • Scientific instruments

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