APF30-30-13CB

APF30-30-13CB

HEATSINK LOW-PROFILE FORGED


Details

Tags

Parameters
Factory Lead Time 18 Weeks
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2006
Series APF
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Thermal Tape, Adhesive (Not Included)
Height Off Base (Height of Fin) 0.500 12.70mm
Thermal Resistance @ Forced Air Flow 2.50°C/W @ 200 LFM
Length 1.181 30.00mm
Width 1.181 30.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

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