APF30-30-06CB/A01

APF30-30-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE


Details

Tags

Parameters
Factory Lead Time 14 Weeks
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2006
Series APF
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.250 6.35mm
Thermal Resistance @ Forced Air Flow 4.40°C/W @ 200 LFM
Length 1.181 30.00mm
Width 1.181 30.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

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