APF19-19-13CB/A01

APF19-19-13CB/A01

Heat Sink Passive BGA Thin Adhesive Aluminum 6063 4C/W Black Anodized


  • Manufacturer: CTS Thermal Management Products
  • Origchip NO: 221-APF19-19-13CB/A01
  • Package: -
  • Datasheet: PDF
  • Stock: 746
  • Description: Heat Sink Passive BGA Thin Adhesive Aluminum 6063 4C/W Black Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 14 Weeks
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2006
Series APF
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.500 12.70mm
Thermal Resistance @ Forced Air Flow 4.00°C/W @ 200 LFM
Length 0.748 19.00mm
Width 0.748 19.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

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