APF19-19-13CB
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Material | Aluminum |
| Shape | Square, Fins |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Material Finish | Black Anodized |
| Published | 2006 |
| Series | APF |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Top Mount |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Height Off Base (Height of Fin) | 0.500 12.70mm |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 200 LFM |
| Device Used On | IC |
| Length | 0.748 19.00mm |
| Width | 0.748 19.00mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet