ADS58C23IPFP
| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) |
| Contact Plating | Gold |
| Mount | Surface Mount |
| Package / Case | 80-TQFP Exposed Pad |
| Number of Pins | 80 |
| Packaging | Tray |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 80 |
| ECCN Code | 5A991.B.1 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Terminal Pitch | 0.5mm |
| Depth | 12.2mm |
| Frequency | 125MHz |
| Base Part Number | ADS58C23 |
| Temperature Grade | INDUSTRIAL |
| Interface | LVDS, Parallel |
| Max Supply Voltage | 3.45V |
| Min Supply Voltage | 3.15V |
| Number of Inputs | 2 |
| Power Consumption | 1.63W |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | Cellular, 3G, LTE, TD-SCDMA |
| Height | 1.2mm |
| Length | 12mm |
| Width | 12mm |
| Thickness | 1mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
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