 
    | Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks | 
| Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) | 
| Contact Plating | Copper, Silver, Tin | 
| Mount | Surface Mount | 
| Mounting Type | Surface Mount | 
| Package / Case | 8-UFBGA, WLCSP | 
| Number of Pins | 8 | 
| Packaging | Tape & Reel (TR) | 
| JESD-609 Code | e1 | 
| Pbfree Code | no | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 8 | 
| ECCN Code | EAR99 | 
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -40°C | 
| Technology | BICMOS | 
| Voltage - Supply | 2.5V~3.3V | 
| Terminal Position | BOTTOM | 
| Terminal Form | BALL | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 3V | 
| Terminal Pitch | 0.5mm | 
| Frequency | 450MHz~6GHz | 
| Time@Peak Reflow Temperature-Max (s) | 40 | 
| Base Part Number | ADL5502 | 
| Pin Count | 8 | 
| Qualification Status | Not Qualified | 
| Temperature Grade | INDUSTRIAL | 
| Operating Supply Current | 3mA | 
| Nominal Supply Current | 3mA | 
| Accuracy | ±0.25dB | 
| Response Time | 15 μs | 
| Telecom IC Type | RF AND BASEBAND CIRCUIT | 
| RF Type | Cellular, CDMA2000, OFDM, W-CDMA | 
| Input Range | -15dBm ~ 12dBm | 
| Height Seated (Max) | 0.625mm | 
| Length | 1.46mm | 
| Width | 1.46mm | 
| REACH SVHC | No SVHC | 
| RoHS Status | ROHS3 Compliant | 
| Lead Free | Contains Lead |