 
    | Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks | 
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) | 
| Contact Plating | Copper, Silver, Tin | 
| Mount | Surface Mount | 
| Package / Case | 6-WFBGA, WLCSP | 
| Number of Pins | 6 | 
| Packaging | Tape & Reel (TR) | 
| JESD-609 Code | e1 | 
| Pbfree Code | no | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 6 | 
| ECCN Code | 5A991.G | 
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -40°C | 
| HTS Code | 8542.39.00.01 | 
| Subcategory | Other Telecom ICs | 
| Terminal Position | BOTTOM | 
| Terminal Form | BALL | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 3V | 
| Terminal Pitch | 0.5mm | 
| Frequency | 2.5GHz | 
| Time@Peak Reflow Temperature-Max (s) | 40 | 
| Base Part Number | AD8311 | 
| Pin Count | 6 | 
| Operating Supply Voltage | 5.5V | 
| Power Supplies | 3/5V | 
| Temperature Grade | INDUSTRIAL | 
| Operating Supply Current | 8.5mA | 
| Nominal Supply Current | 8.5mA | 
| Response Time | 150 ns | 
| Telecom IC Type | TELECOM CIRCUIT | 
| RF Type | GSM | 
| Length | 950μm | 
| Width | 1.45mm | 
| Thickness | 595μm | 
| Radiation Hardening | No | 
| RoHS Status | ROHS3 Compliant | 
| Lead Free | Contains Lead |