| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 6-WFBGA, WLCSP |
| Number of Pins | 6 |
| Packaging | Tape & Reel (TR) |
| JESD-609 Code | e1 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| ECCN Code | 5A991.G |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Telecom ICs |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3V |
| Terminal Pitch | 0.5mm |
| Frequency | 2.5GHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | AD8311 |
| Pin Count | 6 |
| Operating Supply Voltage | 5.5V |
| Power Supplies | 3/5V |
| Temperature Grade | INDUSTRIAL |
| Operating Supply Current | 8.5mA |
| Nominal Supply Current | 8.5mA |
| Response Time | 150 ns |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | GSM |
| Length | 950μm |
| Width | 1.45mm |
| Thickness | 595μm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |