AD6652BBCZ
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 3 days ago) |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA, CSPBGA |
| Number of Pins | 256 |
| Packaging | Tray |
| JESD-609 Code | e1 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | 5A991.G |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 2.5V |
| Frequency | 200MHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Function | IF to Baseband Receiver |
| Operating Supply Voltage | 2.5V |
| Temperature Grade | OTHER |
| Logic Function | Receiver |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | Cellular, AMPS, CDMA, CDMA2000, UMTS, W-CDMA |
| Secondary Attributes | Sample Rates up to 65MSPS |
| Height | 1.16mm |
| Length | 17mm |
| Width | 17mm |
| Thickness | 1.71mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
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