A2F500M3G-FG256

A2F500M3G-FG256

0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-FG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 752
  • Description: 0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V(Kg)

Details

Tags

Parameters
Factory Lead Time 16 Weeks
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Operating Supply Current 2mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Number of Gates 500000
Max Frequency 100MHz
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion? series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops and that is something to note.Housed in the state-of-art Tray package.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.As for its flash size, it is 512KB.Search A2F500M3G for system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.256 pins are present on this computer SoC.Just 0°C is needed to get the SoC computing up and running.There is a design maximum operating temperature of 85°C for this SoC system on chip.There is a maximum supply voltage of 1.575V.At least 1.425V power is delivered to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FG256 System On Chip (SoC) applications.

  • String inverter
  • Mobile market
  • Networked Media Encode/Decode
  • Central alarm system
  • Mobile computing
  • Robotics
  • Three phase UPS
  • RISC-V
  • Central alarm system
  • Multiprocessor system-on-chips (MPSoCs)

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