Parameters |
Factory Lead Time |
12 Weeks |
Package / Case |
256-LBGA |
Number of Pins |
256 |
Supplier Device Package |
256-FPBGA (17x17) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
0°C |
Frequency |
100MHz |
Base Part Number |
A2F500M3G |
Operating Supply Voltage |
1.5V |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Number of I/O |
MCU - 25, FPGA - 66 |
Speed |
100MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Number of Gates |
500000 |
Max Frequency |
120MHz |
Number of Logic Blocks (LABs) |
24 |
Speed Grade |
1 |
Primary Attributes |
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Number of Registers |
11520 |
Flash Size |
512KB |
Radiation Hardening |
No |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion? series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 25, FPGA - 66 I/Os.This flash has a size of 512KB.Searching A2F500M3G will bring up system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 100MHz.It uses ARM as its core architecture.This is the 256-pin version of the computer SoC.Starting the SoC computing is as simple as setting 0°C.This SoC system on chip operates at a maximum design temperature of 85°C.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FG256 System On Chip (SoC) applications.
- AC-input BLDC motor drive
- Embedded systems
- External USB hard disk/SSD
- ARM Cortex M4 microcontroller
- sequence controllers
- Robotics
- RISC-V
- Industrial transport
- Video Imaging
- Central alarm system