A2F500M3G-1FG256

A2F500M3G-1FG256

0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-1FG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 763
  • Description: 0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 25, FPGA - 66
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Number of Gates 500000
Max Frequency 120MHz
Number of Logic Blocks (LABs) 24
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Registers 11520
Flash Size 512KB
Radiation Hardening No
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion? series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 25, FPGA - 66 I/Os.This flash has a size of 512KB.Searching A2F500M3G will bring up system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 100MHz.It uses ARM as its core architecture.This is the 256-pin version of the computer SoC.Starting the SoC computing is as simple as setting 0°C.This SoC system on chip operates at a maximum design temperature of 85°C.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FG256 System On Chip (SoC) applications.

  • AC-input BLDC motor drive
  • Embedded systems
  • External USB hard disk/SSD
  • ARM Cortex M4 microcontroller
  • sequence controllers
  • Robotics
  • RISC-V
  • Industrial transport
  • Video Imaging
  • Central alarm system

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