Parameters |
Factory Lead Time |
12 Weeks |
Package / Case |
288-TFBGA, CSPBGA |
Supplier Device Package |
288-CSP (11x11) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
0°C |
Frequency |
80MHz |
Base Part Number |
A2F200 |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Number of I/O |
MCU - 31, FPGA - 78 |
Speed |
80MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Flash Size |
256KB |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 288-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.In the SmartFusion? series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes MCU - 31, FPGA - 78 I/Os.There is a flash of 256KB on it.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.A frequency of 80MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.In order for the SoC computing to start, 0°C is just about right.There is a design maximum operating temperature 85°C specified for this SoC system on chip.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-CS288 System On Chip (SoC) applications.
- Flow Sensors
- Industrial automation devices
- Level
- DC-input BLDC motor drive
- ARM
- Central inverter
- Efficient hardware for inference of neural networks
- Central alarm system
- Measurement tools
- High-end PLC