A2F200M3F-1FGG256I
| Parameters | |
|---|---|
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 12 Weeks |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | A2F200 |
| Number of I/O | MCU - 25, FPGA - 66 |
| Speed | 100MHz |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 256KB on it.Search A2F200 for system on chips with similar specs and purposes.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
A2F200M3F-1FGG256I System On Chip (SoC) applications.
- String inverter
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