Parameters | |
---|---|
Factory Lead Time | 18 Weeks |
Package / Case | Nonstandard Chip |
Operating Temperature | -55°C~150°C |
Packaging | Tray |
Series | UWSC |
Size / Dimension | 0.010Lx0.010W 0.25mmx0.25mm |
Tolerance | ±15% |
Feature | High Reliability, Low Profile |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Applications | High Stability, Vertical Silicon Cap, Wirebond |
Capacitance | 100pF |
ESR (Equivalent Series Resistance) | 14mOhm |
Voltage - Breakdown | 150V |
ESL (Equivalent Series Inductance) | 6pH |
Height | 0.005 0.12mm |
RoHS Status | ROHS3 Compliant |