| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Package / Case | SOIC |
| Number of Pins | 20 |
| Weight | 28.349523g |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
| Packaging | Bulk |
| Published | 2003 |
| Series | 923 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | SOIC, 0.30 Body |
| Number of Positions | 20 |
| Orientation | Straight |
| Number of Contacts | 20 |
| Row Spacing | 7.62 mm |
| Number of Ports | 1 |
| Number of Poles | 20 |
| REACH SVHC | Unknown |
| RoHS Status | RoHS Compliant |
| Lead Free | Not Applicable |