| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Surface Mount |
| Package / Case | SOIC |
| Number of Pins | 8 |
| Weight | 23.586803g |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Packaging | Bulk |
| Published | 2003 |
| Series | 923 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | SMD/SMT |
| Type | SOIC, 0.15 Body |
| Number of Positions | 8 |
| Number of Contacts | 8 |
| Row Spacing | 7.62 mm |
| Number of Poles | 8 |
| Insulation | Non-Insulated |
| REACH SVHC | Unknown |
| RoHS Status | RoHS Compliant |
| Lead Free | Not Applicable |