89H12NT12G2ZCHLI8
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | FCBGA |
| Number of Pins | 324 |
| Packaging | Tape & Reel (TR) |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 225 |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 324 |
| Operating Supply Voltage | 3.3V |
| Interface | PCI Express |
| Number of Ports | 12 |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Frequency (Max) | 125MHz |
| Data Rate | 96 Gbps |
| Height | 3.02mm |
| Length | 19mm |
| Width | 19mm |
| Thickness | 3.02mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet