834100T00000
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | DPAK |
| Material | Copper |
| Shape | Rectangular, Fins |
| Package Cooled | TO-252 (DPak) |
| Material Finish | Tin |
| Published | 2006 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Top Mount |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.400 10.16mm |
| Thermal Resistance @ Forced Air Flow | 17.50°C/W @ 300 LFM |
| Power Dissipation @ Temperature Rise | 2.5W @ 35°C |
| Height | 10.1mm |
| Length | 0.315 8.00mm |
| Width | 0.900 22.86mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet