82P5088BBG8
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | BGA |
| Packaging | Tape & Reel (TR) |
| Published | 2014 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Circuits | 8 |
| Power Dissipation-Max | 2.57W |
| RoHS Status | RoHS Compliant |
82P5088BBG8 Overview
Space is saved on the board by using the BGA package.For telecommunications equipment packing, the Tape & Reel (TR) method is used.This telecom IC is composed of 8 circuits.A Surface Mount-axis mounts telecom switching.During normal operation, a minimum value of -40°C is set for the temperature.In order to ensure normal operation of the telecom circuit, the temperature is set at the maximum value of 85°C.
82P5088BBG8 Features
Available in the BGA package
82P5088BBG8 Applications
There are a lot of Integrated Device Technology (IDT) 82P5088BBG8 Telecom applications.
- Integrated Access Devices (IADs)
- PCM Test Equipment
- Home Gateway
- Integrated Multi-Service Access Platforms (IMAPs)
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- SDH Multiplexers
- T1/E1/J1 add/drop multiplexers (MUX)
- SONET/SDH terminal
- ISDN Primary Rate Interfaces (PRA)
- T1 Digital Cross Connects (DSX-1)