Parameters |
Mounting Type |
Through Hole |
Package / Case |
16-DIP (0.300, 7.62mm) |
Surface Mount |
NO |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
Series |
74F |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
16 |
Terminal Finish |
TIN LEAD |
Additional Feature |
BCD ADDER; PERMITS RIPPLE CARRY CASCADING |
Technology |
TTL |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Number of Functions |
1 |
Supply Voltage |
4.5V~5.5V |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
16 |
JESD-30 Code |
R-PDIP-T16 |
Qualification Status |
Not Qualified |
Number of Bits |
4 |
Family |
F/FAST |
Logic Type |
Binary Full Adder |
Propagation Delay (tpd) |
15 ns |
Height Seated (Max) |
5.08mm |
Length |
19.305mm |
Width |
7.62mm |
RoHS Status |
Non-RoHS Compliant |
74F583PC Overview
Using Tube as a packaging method is common.It is accessible to the 16-DIP (0.300, 7.62mm) package.For the device to function normally, voltage 4.5V~5.5V is supplied.The Through Hole method of mounting electronic parts on a PCB is one of the most common methods.It is set to operate at a temperature of 0°C~70°C.To store information, the memory has a size of 4 bits.Several similarities exist among electronic parts of the 74F series.The number of all component pins adds up to 16.Using 16 terminations, signals are prevented from reverberating off the end of the transmission line.As far as BCD ADDER; PERMITS RIPPLE CARRY CASCADING is concerned, it provides high performance.This electronic part belongs to the F/FAST family, which is designed for high quality and reliability.
74F583PC Features
74F583PC Applications
There are a lot of Rochester Electronics, LLC 74F583PC Specialty Logic ICs applications.
- Digital systems
- Low power, low voltage systems
- Long-distance fiber optic network applications
- Cordless telephone
- Radio transmission
- Satellite radio receiver
- Wireless multimedia center in smart home
- Cell phones
- interconnection between computers
- Satellite communications networks